Synthesis of Chitosan-Based Hybrid Organic-Inorganic Nanocomposites: An Investigation of Thermal, Optical and Electrical Properties
Considerable advancements have been achieved in material science through the integration of nanomaterials into polymeric matrices. This study investigates the fabrication and characterization of novel Chitosan/Polyvinyl Alcohol (CHT/PVA) hybrid nanocomposites reinforced with varying volumetric ratios of Multi-Walled Carbon Nanotubes (MWCNTs) and greensynthesized Silver Nanoparticles (AgNPs). Thin lms containing CHT/MWCNT and PVA/AgNPs blends were successfully prepared via a controlled physical blending approach. Structural analysis using FT-IR spectroscopy confirmed physical interactions and hydrogen bonding between the co-fillers and the polymeric matrices. SEM micrographs indicated homogeneous filler dispersion within the polymer blend. Thermal analysis via TGA/DSC demonstrated that the inclusion of a 1:1 volumetric fraction of PVA/Ag and CHT/CNT (1Ag=1CNT) blends significantly enhanced the thermal stability, yielding a maximum residual weight of 40% at elevated temperatures. Optical analysis revealed remarkable UV-shielding performance, while the 2Ag/1CNT sample exhibited a prominent surface plasmon resonance (SPR) absorption peak in the visible region at 422 nm . The optical band gap systematically decreased to around 4 eV for both the CHT/CNT and 1Ag/1CNT films, reaching minimum values of 3.6 eV and 2.9 eV for the 1Ag/2CNT and 2Ag/1CNT nanocomposites, respectively. Steady-state direct current (DC) electrical measurements revealed that the 1Ag/1CNT hybrid attained an optimal conductivity σdc of 875 S/m at 600C. Alternating current (AC) analysis highlighted the 1Ag/2CNT nanocomposite as the superior hybrid due to the formation of an efficient CNT-dominated percolation network. Conversely, an excess of silver content (2Ag/1CNT) drastically suppressed the AC conductivity, suggesting that high Ag concentrations disrupt optimal conduction pathways. These highly functional materials hold great potential for flexible electronics and smart applications requiring combined thermal endurance and electrical performance.